BAFS :. The is a headphone driver with an AVC circuit that keeps the output below a fixed level. It low current consumption, and low output noise, and is ideal for use in portable digital audio equipment. F 1 Low current consumption when VCC 2. LM - 1.
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Special features of the device are: The power dissipation in any short-circuit condition is very low. The circuit in Fig. Plastic or metal protrusions of 0. SOLDERING Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max.
If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
Manual soldering Apply the soldering iron 24 V or less to the lead s of the package, either below the seating plane or not more than 2 mm above it. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
Stress above one or more of the limiting values may cause permanent damage to the device. Exposure to limiting values for extended periods may affect device reliability. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Box , Tel. Buncit Raya Kav. VB, Tel. Salcedo Village, P. Box Newville , Tel. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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2 x 32 Watts stereo amplifier